Radiation-sensitive resin composition

Abstract

A radiation-sensitive resin composition useful as a chemically amplified resist excelling particularly in depth of focus (DOF) and capability of substantially decreasing development defects, while maintaining excellent basic performance as a resist is provided. The radiation-sensitive resin composition comprises (A) a siloxane resin containing an acid-dissociable group and (B) a photoacid generator, wherein when a coating formed from the radiation-sensitive resin composition is exposed to radiation and heated, the contact angle (α) with water in an unexposed area and the contact angle (β) with water in an exposed area satisfy an inequality formula of (α−β)>5. The component (A) is preferably a compound having a structural unit (I) shown by the following formula (I) and a structural unit (II) shown by the following formula (II), wherein A represents a substituted or unsubstituted divalent cyclic hydrocarbon group, R1 represents a monovalent acid-dissociable group, X represents a single bond or a substituted or unsubstituted divalent hydrocarbon group, Y represents a single bond or a divalent coupling means, and Z represents a single bond or a substituted or unsubstituted divalent hydrocarbon group.

Dependencies are inferred from the claim text.