Thermal conductor and use thereof
OwnerGary Oberlininventor
Life of this patent
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Abstract
A thermal conductor suitable for communicating heat from an integrated circuit to a thermal transfer device is disclosed. The thermal conductor comprises a base having a first portion and a second portion, wherein the first portion is adapted to be positioned substantially planar to and proximate the integrated circuit, and further wherein the second portion includes sidewalls that define an aperture in the body and forms a spherical cavity, and wherein the aperture is adapted to pivotally receive at least a portion of the thermal transfer device such that at least a portion of the thermal transfer device is in thermal communication with the integrated circuit.
Claims21
A thermal conductor suitable for communicating heat from an integrated circuit to a thermal transfer device, said thermal conductor comprising:
- a base having a first portion and a second portion,
- wherein said first portion is adapted to be positioned proximate the integrated circuit, and
- further wherein the second portion includes sidewalls that define a spherical cavity in said base, and wherein the spherical cavity is adapted to pivotally receive at least a portion of the thermal transfer device such that at least a portion of the thermal transfer device is in thermal communication with the integrated circuit.
5 The thermal conductor from claim 1, wherein said spherical cavity of said second portion and an end of the thermal transfer device respectively define female and male thermally mating spherical interfaces.
The thermal conductor from claim 5, wherein said aperture and the end of the thermal transfer device are adapted to urge said thermal conductor and said integrated circuit to planarly align.
A thermal transfer assembly comprising:
- a substrate;
- at least one integrated circuit attached to said substrate, said at least one integrated circuit having a first dimension and a second dimension forming a perimeter;
- and
- at least one thermal conductor attached to each of said at least one integrated circuit, wherein said at least one thermal conductor has a fist dimension and a second dimension forming a perimeter,
- wherein at least one of said dimensions of said at least one thermal conductor is larger than the corresponding dimension of said at least one integrated circuit.
A method for manufacturing a device for dissipating heat in a thermal junction, the thermal junction including a substrate and an integrated circuit electrically connected thereto, said method comprising the steps of:
- attaching a thermal conductor to the integrated circuit, wherein the thermal conductor includes a dimension larger than a common dimension of the integrated circuit;
- thermally connecting a thermal transfer device to the integrated circuit;
- biasing said thermal device such that force is added between said thermal transfer device and said thermal conductor;
- and
- urging said thermal transfer device in said aperture such that the thermal conductor and the integrated circuit substantially planarly align.
Dependencies are inferred from the claim text.