Heat dissipating structure of interface card
AssigneeInventec Corporation
InventorSpring Liu
Life of this patent
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Abstract
A heat dissipating structure of an interface card is applied in an electronic device. The structure includes a heat dissipating apparatus attached to a circuit board of the electronic device, wherein the heat dissipating apparatus comprises a heat sink and a fan received in a room of the heat sink; and an interface card electrically connected to the circuit board of the electronic device via a connector. At least a surface of the interface card that is mounted with semiconductor components is mounted on top of a part of the heat dissipating apparatus in a faced-down manner to dissipate heat generated during operations of the semiconductor components to an external environment through the heat sink and the fan.
Claims11
A heat dissipating structure of an interface card applicable in an electronic device, comprising:
- a heat dissipating apparatus mounting on a circuit board of the electronic device comprising a heat sink and a fan, the heat sink providing a room for receiving the fan;
- and
- an interface card electrically connected and mounted on the circuit board of the electronic device via a connector, wherein at least one surface of the interface card that is mounted with at least one semiconductor component is provided on top of at least a part of the heat dissipating apparatus in an faced-down manner to dissipate heat generated during operations of the at least one semiconductor component to an external environment through the heat sink and the fan.
Dependencies are inferred from the claim text.