LGA socket with emi protection
AssigneeTyco Electronics Corporation
InventorsDavid Trout, Richard Whyne
Life of this patent
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Abstract
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. A grounding clip surrounds the housing and is conductively connected to the substrate, and has spring arms which are connectable to heat sink hardware on one side thereof and to a printed circuit board on the other side.
Claims21
An LGA interconnect, comprising a substrate and a plurality of contact assemblies, said substrate having said contact assemblies arranged in an array, each said contact assembly comprised of at least one metal contact being positioned on said substrate, positioning a first contact member of said metal contact above said substrate and a second contact member of said metal contact below said substrate, a housing assembly positioned around a substantial periphery of said substrate, and a grounding clip attached to said substrate and extending around a substantial portion of said housing assembly to protect said substrate from electromagnetic interference.
An LGA interconnect, comprising:
- a metal substrate having an upper surface and a lower surface;
- a plurality of contact assemblies, each contact assembly comprised of at least one metal contact and an insulative member, said metal contacts being connected to the substrate by said insulative member;
- and
- a conductive grounding clip attached to, and grounded to said substrate.
The LGA interconnect of claim 12, further comprising an insulative housing assembly positioned around a substantial periphery of said substrate.
Dependencies are inferred from the claim text.