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US 2006/0220236 A1Published application
Semiconductor device with power module housed in casing
AssigneesToyota Jidosha Kabushiki Kaisha, Kyoho Machine Works, Ltd.
InventorsTakaji Kikuchi, Takeshi Menjo
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Abstract
An electrically insulating member is provided between a bus bar of an IPM and a nearby casing so as to electrically insulate the casing from the bus bar of the IPM. Above the portion where electrical insulation is necessary, a bracket provided for supporting a component-to-be supported is secured to the casing. The electrically insulating member is attached to a lower portion of the bracket that is an existing component.
Claims6
A semiconductor device comprising:
- an electrically conductive casing;
- a power module portion housed in said casing and having at least one electrically non-insulating portion located near said casing;
- a component fixedly provided in the vicinity of said electrically non-insulating portion and within said casing and having a predetermined capability;
- and
- an electrically insulating member provided between said electrically non-insulating portion of said power module portion and said casing and attached to said component.
2 more elements
A semiconductor device comprising:
- an electrically conductive casing;
- a power module portion housed in said casing and having at least one electrically non-insulating portion located near said casing;
- and
- a component fixedly provided in the vicinity of said electrically non-insulating portion and within said casing and having a predetermined capability, wherein
- said component includes:
- an essential-capability portion having said predetermined capability;
- and
- an electrical-insulation-capability portion connected to said essential-capability portion, and
- said electrical-insulation-capability portion is formed to be provided between said electrically non-insulating portion of said power module portion and said casing.
6 more elements
Dependencies are inferred from the claim text.