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US 2006/0220200 A1Published application
Substrate for IC package
AssigneeLingsen Precision Industries, Ltd.
InventorHsin-Chen Yang
Life of this patent
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Abstract
A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space and forming with the pins and the chip pad a platform, and lead wires located at the insulative member for connecting pins directly or through a passive component.
Claims7
A packaging substrate comprising a plurality of packaging units arranged in an array, said packaging units each comprising:
- at least one chip pad for carrying a chip;
- a plurality of pins arranged around said at least one chip pad and spaced from one another and said at least one chip pad by an open space;
- and
- an insulative member filling up said open space;
- wherein said packaging units each further comprise:
- at least one lead wire located at said insulative member for connecting said pins, and
- further wherein each of said packaging units is a unitary platform having a smooth top surface.
4 more elements
Dependencies are inferred from the claim text.