Semiconductor device
AssigneeSanyo Electric Co., Ltd.
InventorsShuichi Kikuchi, Shigeaki Okawa, Kiyofumi Nakaya, Toshiyuki Takahashi
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AssigneeSanyo Electric Co., Ltd.
InventorsShuichi Kikuchi, Shigeaki Okawa, Kiyofumi Nakaya, Toshiyuki Takahashi
Estimating the term…
In a semiconductor device of the present invention, a protection diode for protecting a device is formed on an epitaxial layer formed on a substrate. A Schottky barrier metal layer is formed on a surface of the epitaxial layer and a P-type diffusion layer is formed at a lower portion of an end portion of the Schottky barrier metal layer. Then, a P-type diffusion layer is formed to be connected to a P-type diffusion layer and is extended to a cathode region. A metal layer to which an anode electrode is applied is formed above the P-type diffusion layer, thereby making it possible to obtain a field plate effect. This structure reduces a large change in a curvature of a depletion layer, thereby improving a withstand voltage characteristic of the protection diode.
A semiconductor device comprising:
Dependencies are inferred from the claim text.