Test key having a chain circuit and a kelvin structure
AssigneeUnited Microelectronics Corp.
InventorsHsin-Chang Wu, Tzu-Chien Chuang
Life of this patent
Estimating the term…
Abstract
A test key formed on a semiconductor substrate has a plurality of electronic components, a plurality of conductors, a plurality of vias for connecting the electronic components and the conductors, a first pad, a second pad, a third pad, and a fourth pad. The first pad, the electronic components, the vias, the conductors, and the second pad connects in series to form a chain circuit, and the first pad and the second pad are positioned at two ends of the chain circuit. A Kelvin structure is composed of the third pad, the fourth pad, one of the conductors, one of the vias, and one of the electronic components.
Claims7
A test key formed on a semiconductor substrate, the test key comprising:
- a plurality of electronic components formed in the semiconductor substrate;
- a plurality of conductors formed in a conductive layer;
- a plurality of vias for connecting the electronic components and the conductors;
- a first pad;
- a second pad, wherein the first pad, the electronic components, the vias, the conductors, and the second pad connect in series to form a chain circuit, and the first pad and the second pad are positioned at two ends of the chain circuit;
- a third pad electrically connected to a first end of a test via;
- and
- a fourth pad electrically connected to a second end of the test via;
- wherein the third and fourth pads of the test key measure a voltage gap between the first and second ends of the test via.
A test key formed on a semiconductor substrate, the test key comprising:
- a plurality of electronic components formed in the semiconductor substrate;
- a plurality of conductors formed in a conductive layer;
- a plurality of vias for connecting the electronic components and the conductors;
- a first pad;
- a second pad, wherein the first pad, the electronic components, the vias, the conductors, and the second pad connect in series to form a chain circuit, and the first pad and the second pad are positioned at two ends of the chain circuit;
- a third pad electrically connected to a first end of a test via through a test conductor;
- and
- a fourth pad electrically connected to a second end of the test via through a test electronic component;
- wherein the third and fourth pads of the test key measure a voltage gap between the first and second ends of the test via.
5-6. (canceled)
Dependencies are inferred from the claim text.