Optical semiconductor device and fabrication method thereof
AssigneeFujitsu Limited
InventorsTsuyoshi Yamamoto, Mitsuru Ekawa
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AssigneeFujitsu Limited
InventorsTsuyoshi Yamamoto, Mitsuru Ekawa
Estimating the term…
In order to prevent As/P replacement at the boundary face of a re-grown semiconductor layer and avoid a crystalline defect caused by the replacement, there is provided an optical semiconductor device comprising: a semiconductor substrate; a striped stacking body including a first semiconductor layer, an active layer, and a second semiconductor layer; and a burying layer burying the striped stacking body striped stacking body, wherein surfaces in contact with a side face and a bottom face of the burying layer are made of a compound semiconductor that contains arsenic (As) alone as a group V element, and a portion other than the surface includes a group V element other than arsenic.
An optical semiconductor device comprising:
A method for fabricating an optical semiconductor device, comprising the steps of:
Dependencies are inferred from the claim text.