Sputtering target of silver alloy for producing reflection layer of optical recording medium

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.1 to 20 wt % of Zn, 0.1 to 3 wt % of Al, totally 0.005 to 0.05 wt % of one or more elements selected from Ca, Be, and Si, and a balance of Ag.

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.1 to 20 wt % of Zn, 0.1 to 3 wt % of Al, totally 0.1 to 3 wt % of one or more elements selected from Dy, La, Nd, Th, and Gd, and a balance of Ag.

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.1 to 20 wt % of Zn, 0.1 to 3 wt % of Al, totally 0.005 to 0.05 wt % of one or more elements selected from Ca, Be, and Si, totally 0.1 to 3 wt % of one or more elements selected from Dy, La, Nd, Tb, and Gd, and a balance of Ag.

An Ag alloy sputtering target for producing full reflection layers of optical recording mediums, the target comprising an Ag alloy containing 1 to 20 wt % of Zn, 0.5 to 3 wt % of Al, and a balance of Ag.

An Ag alloy sputtering target for producing full reflection layers of optical recording mediums, the target comprising an Ag alloy containing 1 to 20 wt % of Zn, 0.5 to 3 wt % of Al, totally 0.005 to 0.05 wt % of one or more elements selected from Ca, Be, and Si, and a balance of Ag.

An Ag alloy sputtering target for producing full reflection layers of optical recording mediums, the target comprising an Ag alloy containing 1 to 20 wt % of Z%, 0.5 to 3 wt % of Al, totally 0.1 to 3 wt % of one or more elements selected from Dy, La, Nd, Th, and Gd, and a balance of Ag.

An Ag alloy sputtering target for producing fill reflection layers of optical recording mediums, the target comprising an Ag alloy containing 1 to 20 wt % of Zn, 0.5 to 3 wt % of Al, totally 0.005 to 0.05 wt % of one or more elements selected from Ca, Be, and Si, and totally 0.1 to 3 wt % of one or more elements selected from Dy, La, Nd, Tb, and Gd, and a balance of Ag.

An Ag alloy sputtering target for producing semi-reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.1 to less than 1 wt % of Zn, 0.1 to less than 0.5 wt % of Al, and a balance of Ag.

An Ag alloy sputtering target for producing semi-reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.1 to less than 1 wt % of Zn, 0.1 to less than 0.5 wt % of Al, totally 0.005 to 0.05 wt % of one or more elements selected from Ca, Be, and Si, and a balance of Ag.

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.5 to 5 wt % of Cu, 0.05 to 2 wt % of Ni. and a balance of Ag.

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.5 to 5 wt % of Cu, 0.05 to 2 wt % of Ni, additionally containing totally 0.005 to 0.05 wt % of one or more elements selected from Ca, Be, and Si, and a balance of Ag.

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.5 to 5 wt % of Cu, 0.05 to 2 wt % of Ni, additionally containing totally 0.1 to 3 wt % of one or more elements selected from Dy, La, Nd, Th, and Gd, and a balance of Ag.

An Ag alloy sputtering target for producing reflection layers of optical recording mediums, the target comprising an Ag alloy containing 0.5 to 5 wt % of Cu. 0.05 to 2 wt % of Ni, totally 0.005 to 0.0 5 wt % of one or more elements selected from Ca, Be, Si, totally 0.1 to 3 wt % of one or more elements selected from Dy, La, Nd, Th, and Gd, and a balance of Ag.