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US 2006/0219430 A1Published application
Land structure, printed wiring board, and electronic device
AssigneeMitsumi Electric Co., Ltd.
InventorKoji Otani
Life of this patent
Estimating the term…
Abstract
A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side. The end side may make a designated angle from an end line of the connection part of the electronic part.
Claims18
A land part where a connection part of an electronic part is soldered, comprising:
- a head end part;
- wherein the head end part includes an inclination part.
A printed wiring board where a land part is formed, the land part being where a connection part of an electronic part is soldered, the land part comprising:
- a head end part;
- wherein the head end part includes an inclination part.
An electronic device, comprising:
- an electronic part;
- a printed wiring board where a land part is formed, the land part being where a connection part of an electronic part is soldered, the land part comprising:
- a head end part;
- wherein the head end part includes an inclination part.
1 more element
Dependencies are inferred from the claim text.