System and apparatus for fixing a substrate with a heat transferring device
AssigneeTyco Electronics Power Systems, Inc.
InventorsMichael Bell, David Stevens, Anthony Schneeman, William Woods, Yi-Teh Shih
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AssigneeTyco Electronics Power Systems, Inc.
InventorsMichael Bell, David Stevens, Anthony Schneeman, William Woods, Yi-Teh Shih
Estimating the term…
A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member interferingly fitting within at least one of a first aperture in said substrate and a second aperture in said heat transferring device to maintain a predetermined separation between said substrate and said heat transferring device in said assembled orientation.
A system for fixing a substrate with a heat transferring device in an assembled orientation;
A system for fixing a substrate with a heat transferring device in an assembled orientation;
An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation;
Dependencies are inferred from the claim text.