Substrate processing apparatus and substrate processing method
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorKatsuhiko Miya
Life of this patent
Estimating the term…
Abstract
An on-off valve 81 is opened during rinsing, whereby a part of DIW supplied to a processing liquid supply section 43 is guided into inside a suction pipe 82. After rinsing, a puddle is formed between a lower cleaning nozzle 29 and the bottom surface of a wafer. As the on-off valve 81 is opened while an on-off valve 86 is kept close, the puddle is sucked at a first speed (V1) which is regulated by a needle valve 85 and set to a relatively slow speed. Once the puddle is collected into inside the lower cleaning nozzle 29, the on-off valve 86 is opened so that the puddle is sucked at a second speed (V2) which is regulated by a needle valve 84 and which is faster than said first speed.
Claims20
A substrate processing method, comprising:
- a rinsing step of supplying a first processing liquid to a nozzle via a supplier connected with said nozzle, discharging said first processing liquid from said nozzle toward a substrate and rinsing said substrate with said first processing liquid;
- and
- a suction step of sucking drops of said first processing liquid adhering to said nozzle and said supplier along a suction channel whose one end is connected with said supplier and removing drops of said first processing liquid from said nozzle and said supplier,
- wherein said first processing liquid is supplied to said suction channel via said supplier at said rinsing step and said suction channel is filled up with said first processing liquid.
A substrate processing method, comprising:
- a first step of supplying a first processing liquid to a nozzle, which is disposed away from the bottom surface of a substrate, via a supplier connected with said nozzle while rotating said substrate, discharging said first processing liquid from a top end portion of said nozzle toward the bottom surface of said substrate and supplying said first processing liquid to the entire bottom surface of said substrate;
- a second step of supplying a second processing liquid to said nozzle via said supplier after said first step, discharging said second processing liquid from said top end portion of said nozzle toward the bottom surface of said substrate and forming a puddle between a bottom central region of said substrate and said top end portion of said nozzle;
- and
- a third step of sucking said puddle from said top end portion of said nozzle along a suction channel whose one end is connected with said supplier and removing said puddle from between said bottom central region of said substrate and said top end portion of said nozzle,
- wherein either said first processing liquid or said second processing liquid is supplied to said suction channel via said supplier before said third step, and said suction channel is filled up with said processing liquid.
A substrate processing apparatus in which a first processing liquid is discharged from a nozzle to a substrate and said substrate is rinsed with said first processing liquid, comprising:
- a supplier which is connected with said nozzle, guides said first processing liquid to said nozzle and discharges said first processing liquid from said nozzle;
- and
- a suction device which sucks drops of said first processing liquid adhering to said nozzle and said supplier after rinsing along a suction channel whose one end is connected with said supplier and removes drops of said first processing liquid from said nozzle and said supplier,
- wherein said first processing liquid is supplied to said suction channel via said supplier during rinsing, and said suction channel is filled up with said first processing liquid.
A substrate processing apparatus in which a first processing liquid is discharged from a top end portion of a nozzle, which is disposed away from the bottom surface of a substrate, toward a bottom central region of said substrate while rotating said substrate and the entire bottom surface of said substrate is rinsed with said first processing liquid, comprising:
- a supplier which guides a second processing liquid to said nozzle, discharges said second processing liquid from said top end portion of said nozzle to the bottom surface of said substrate which has been rinsed, and forms a puddle between said bottom central region of said substrate and said top end portion of said nozzle;
- and
- a suction device which sucks said puddle from said top end portion of said nozzle along a suction channel whose one end is connected with said supplier and removes said puddle from between said bottom central region of said substrate and said top end portion of said nozzle,
- wherein either said first processing liquid or said second processing liquid is supplied to said suction channel via said supplier before suction of said puddle, and said suction channel is filled up with said processing liquid.
A substrate processing method, comprising:
- a rinsing step of supplying a first processing liquid to a nozzle via a supplier which is connected with said nozzle, discharging said first processing liquid from said nozzle toward a substrate and rinsing said substrate with said first processing liquid;
- and
- a suction step of sucking drops of said first processing liquid adhering to said nozzle and said supplier along a suction channel whose one end is connected with said supplier and removing drops of said first processing liquid from said nozzle and said supplier,
- wherein at said suction step, drops of said first processing liquid are sucked while accelerating the speed of sucking drops of said first processing liquid over at least two stages from a first speed to a second speed which is faster than said first speed.
A substrate processing method, comprising:
- a first step of supplying a first processing liquid to a nozzle, which is disposed away from the bottom surface of a substrate, via a supplier connected with said nozzle while rotating said substrate, discharging said first processing liquid from a top end portion of said nozzle toward the bottom surface of said substrate and supplying said first processing liquid to the bottom entire surface of said substrate;
- a second step of supplying a second processing liquid to said nozzle via said supplier after said first step, discharging said second processing liquid from said top end portion of said nozzle toward the bottom surface of said substrate and forming a puddle between a bottom central region of said substrate and said top end portion of said nozzle;
- and
- a third step of sucking said puddle from said top end portion of said nozzle along a suction channel whose one end is connected with said supplier and removing said puddle from between said bottom central region of said substrate and said top end portion of said nozzle,
- wherein at said third step, said puddle is sucked while accelerating the speed of sucking said puddle over at least two stages from a first speed to a second speed which is faster than said first speed.
A substrate processing apparatus in which a first processing liquid is discharged from a nozzle to a substrate and said substrate is rinsed with said first processing liquid, comprising:
- a supplier which is connected with said nozzle, guides said first processing liquid to said nozzle and discharges said first processing liquid from said nozzle;
- a suction device which sucks drops of said first processing liquid adhering to said nozzle and said supplier after rinsing along a suction channel whose one end is connected with said supplier and removes drops of said first processing liquid from said nozzle and said supplier;
- a suction speed setting unit which is disposed on said suction channel and sets the speed of sucking drops of said first processing liquid;
- and
- a controller which controls said suction speed setting unit, thereby changing the speed of sucking drops of said first processing liquid over at least two stages from a first speed to a second speed which is faster than said first speed.
A substrate processing apparatus in which a first processing liquid is discharged from a top end portion of a nozzle, which is disposed away from the bottom surface of a substrate, toward a bottom central region of said substrate while rotating said substrate and the entire bottom surface of said substrate is rinsed with said first processing liquid, comprising:
- a supplier which guides a second processing liquid to said nozzle, discharges said second processing liquid from said top end portion of said nozzle to the bottom surface of said substrate which has been rinsed, and forms a puddle between said bottom central region of said substrate and said top end portion of said nozzle;
- a suction device which sucks said puddle from said top end portion of said nozzle along a suction channel whose one end is connected with said supplier and removes said puddle from between said bottom central region of said substrate and said top end portion of said nozzle;
- a suction speed setting unit which is disposed on said suction channel and sets the speed of sucking said puddle;
- and
- a controller which controls said suction speed setting unit, thereby changing the speed of sucking said puddle over at least two stages from a first speed to a second speed which is faster than said first speed.
Dependencies are inferred from the claim text.