Substrate treatment apparatus and substrate treatment method
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsMasaki Iwami, Soichi Nadahara
Life of this patent
Estimating the term…
Abstract
A substrate treatment apparatus includes a substrate holding mechanism which holds a substrate, a scrub brush for scrubbing a surface of the substrate held by the substrate holding mechanism to remove foreign matter from the substrate surface, a treatment liquid supplying mechanism which supplies an alkaline treatment liquid to the substrate surface when the substrate is scrubbed with the scrub brush, and an alkaline fluid supplying mechanism which supplies an alkaline fluid to a surface of the scrub brush in a standby period during which no substrate is scrubbed with the scrub brush.
Claims15
A substrate treatment apparatus, comprising:
- a substrate holding mechanism which holds a substrate;
- a scrub brush for scrubbing a surface of the substrate held by the substrate holding mechanism to remove foreign matter from the substrate surface;
- a treatment liquid supplying mechanism which supplies an alkaline treatment liquid to the surface of the substrate when the substrate is scrubbed with the scrub brush;
- and
- an alkaline fluid supplying mechanism which supplies an alkaline fluid to a surface of the scrub brush in a standby period during which no substrate is scrubbed with the scrub brush.
A substrate treatment apparatus, comprising:
- a substrate holding mechanism which holds a substrate;
- a scrub brush for scrubbing a surface of the substrate held by the substrate holding mechanism to remove foreign matter from the substrate surface;
- and
- an alkaline gas supplying mechanism which supplies an alkaline gas to a surface of the scrub brush in a standby period during which no substrate is scrubbed with the scrub brush.
A substrate treatment method, comprising the steps of:
- scrubbing a surface of a substrate with a scrub brush to remove foreign matter from the substrate surface;
- supplying an alkaline treatment liquid to the substrate surface in parallel with the scrubbing step;
- and
- supplying an alkaline fluid to a surface of the scrub brush to keep the scrub brush and foreign matter adhering to the scrub brush at a negative zeta potential in a standby period during which no substrate is scrubbed with the scrub brush.
A substrate treatment method, comprising the steps of:
- scrubbing a surface of a substrate with a scrub brush to remove foreign matter from the substrate surface;
- and
- supplying an alkaline gas to a surface of the scrub brush to causes the scrub brush and foreign matter adhering to the scrub brush to have a negative zeta potential in a standby period during which no substrate is scrubbed with the scrub brush.
Dependencies are inferred from the claim text.