Device for applying semiconductor treatment to treatment subject substrate

An apparatus for performing a semiconductor process on a target substrate, comprising:

• a process container configured to accommodate the target substrate;
• a gas supply system configured to supply a process gas into the process container;
• a worktable disposed in the process container, the worktable having an upper surface on which the target substrate is placed, and a lower surface which is exposed inside the process container;
• and
• a lifting mechanism configured to assist transfer of the target substrate with respect to the upper surface of the worktable,
• wherein the lifting mechanism comprises
• a lifter pin configured to support the target substrate,
• a driving unit configured to move the lifter pin up and down, and
• a guide hole configured to guide the lifter pin being moved up and down, the guide hole comprising a main hole portion which extends from the upper surface to the lower surface through the worktable, and an extended hole portion which extends into an extension sleeve which projects downward from the lower surface of the worktable to correspond to the main hole portion.