Method and system for depositing material on a substrate using a solid precursor
AssigneeTokyo Electron Limited
InventorJozef Brcka
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Abstract
A system and method is disclosed for vaporizing a solid precursor and transporting the precursor vapor to a process chamber. The film precursor vaporization system is coupled to the process chamber and positioned directly above the substrate. A precursor valve system within the film precursor vaporization system permits closing off the flow of precursor vapor to the process chamber while carrier gas flows through or over the film precursor, and once the carrier gas is saturated with precursor vapor, the precursor valve system is opened to permit the flow of precursor vapor to the substrate.
Claims18
A deposition system for forming a thin film on a substrate comprising:
- a process chamber having a substrate holder configured to support said substrate and heat said substrate, and a pumping system configured to evacuate said process chamber;
- and
- a film precursor vaporization system coupled to said process chamber above said substrate and configured to vaporize a film precursor, and to transport film precursor vapor in a carrier gas, wherein said film precursor vaporization system comprises:
- a housing positioned above the process chamber and having an opening in a bottom of said housing that is in general alignment with an opening in a top of said process chamber;
- and
- a precursor tray supported within said housing and an annular space formed between said precursor tray and said housing wherein the precursor tray is configured to support said film precursor, and wherein said precursor tray is coupled to a carrier gas supply system configured to flow said carrier gas through or over said film precursor, through said annular space, and through said opening in the bottom of said housing.
Dependencies are inferred from the claim text.