Semiconductor manufacturing apparatus and semiconductor device manufacturing method
OwnerKazuo Saki, Yukihiro Ushikuinventors
Life of this patent
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Abstract
A semiconductor manufacturing apparatus includes a processing apparatus main body which executes a process related to manufacturing a semiconductor device, an internal apparatus controller which supplies a start signal to start a process and a stop signal to stop the process of the semiconductor device within the processing apparatus main body, and a process controller which calculates a physical characteristic of the semiconductor device currently being processed and sends the stop signal to the apparatus controller when a calculated value reaches a predetermined value.
Claims17
A semiconductor manufacturing apparatus comprising:
- a processing apparatus main body which executes a process related to manufacturing of a semiconductor device;
- an internal process information determination unit which determines in real time internal process information of the processing apparatus main body by measuring at least one of a pressure, temperature, mass flow, voltage, current, and plasma charge of the processing apparatus main body;
- an apparatus controller unit which supplies a start signal to start a process and a stop signal to stop the process to the semiconductor device being processed within the processing apparatus main body;
- and
- a process controller unit which receives the start signal and the internal process information has a function of periodically calculating in real time a physical characteristic of the semiconductor device using the internal process information, starts calculating the physical characteristic of the semiconductor device currently being processed at a timing when the start signal is sent from the apparatus controller unit, and sends the stop signal to the apparatus controller unit when a calculated value of the physical characteristic of the semiconductor device being processed reaches a predetermined value.
-3. (canceled)
-13. (canceled)
A semiconductor device manufacturing method of executing a predetermined process for a substrate to be processed using a semiconductor manufacturing device comprising a processing apparatus main body which executes a process related to manufacturing of a semiconductor device, an apparatus controller unit which controls start and stop of the process in the processing apparatus main body, and a process controller unit which receives a start signal and internal process information of the processing apparatus main body and periodically calculates in real time a physical characteristic of the substrate, the method comprising:
- while the substrate to be processed is set in the processing apparatus main body, causing the apparatus controller unit to start the predetermined process, causing the internal process information to be determined in real time by measuring at least one of a pressure, temperature, mass flow, voltage, current, and plasma charge of the processing apparatus main body, causing the process controller unit to start calculating a physical characteristic of the substrate for the current process;
- and
- when the process controller unit judges, based on a calculation results that the physical characteristic of the substrate reaches a predetermined value, causing the apparatus controller unit to stop the current process and switch to a next process.
(canceled)
Dependencies are inferred from the claim text.