Integrated circuit package socket and socket contact
AssigneeIntel Corporation
InventorsShawn Lloyd, John Oldendorf, J. Lewis, Michael Kochanowski
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.
Claims20
An integrated circuit (IC) package socket, comprising:
- a package receiving portion including a package surface and an opposite contact pad surface;
- and
- an array of contact pins arranged in the package receiving portion where each contact pin is formed from a single piece of conductive material, each contact pin has a central mounting portion and first and second ends extending from the central mounting portion, where the first and second ends are independently resilient, where a first portion of the contact pin including the first end extends from the central mounting portion away from the package surface, around an acutely bent angle and then toward the package surface, and where a second portion of the contact pin including the second end extends away from the contact pad surface, around an acutely bent angle, and then toward the contact pad surface.
A method of electrically connecting an integrated circuit (IC) package to a contact pad on a circuit board, comprising:
- mounting an array of contact pins in a socket;
- mounting the socket on the circuit board;
- contacting the contact pad on the circuit board with a sharp first end of each of the contact pins, laterally swiping the contact pad with the sharp first end of each contact pin;
- and
- contacting an array of package lands on the IC package with a sharp second end of each of the contact pins, laterally swiping each package land with the sharp second end of each corresponding contact pin;
- where the first end of a contact pin is independently resilient from the second end of the contact pin;
- where a first portion of one of the contact pins including the first sharp end extends from a central mounting portion away from the package land, around an acutely bent angle and then toward the package land;
- and
- where a second portion of the one contact pin including the second sharp end extends away from the contact pad, around an acutely bent angle, and then toward the contact pad.
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Dependencies are inferred from the claim text.