Flip chip interconnection having narrow interconnection sites on the substrate
AssigneeSTATS ChipPAC, Ltd.
InventorRajendra Pendse
Life of this patent
Estimating the term…
Abstract
A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow interconnect pad is less than a base diameter of bumps on the die to be attached. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having narrow interconnect pads on electrically conductive traces in a die attach surface, in which the bumps are mated onto the narrow pads on the traces.
Claims34
A flip chip interconnection, comprising a solder bump attached to an interconnect pad on a die and mated onto a pad at an interconnect site on a substrate, wherein a width of the pad at the interconnect site is less than a nominal width of the contact interface between the bump and the die pad.
A flip chip interconnection, comprising a solder bump attached to an interconnect pad on a die and mated onto a pad at an interconnect site on a substrate, wherein a width of the pad at the interconnect site is less than a design width of the contact interface between the bump and the die pad.
A flip chip semiconductor package comprising a plurality of solder bumps each attached to an interconnect pad on a die and mated onto a corresponding a pad at an interconnect site on a substrate, wherein a width of the pad at the interconnect site is less than a nominal width of the contact interface between the bump and the die pad.
A flip chip semiconductor package comprising a plurality of solder bumps each attached to an interconnect pad on a die and mated onto a corresponding a pad at an interconnect site on a substrate, wherein a width of the pad at the interconnect site is less than a design width of the contact interface between the bump and the die pad.
A substrate for flip chip interconnection of a die, the die having a bumps each attached on a die pad, the substrate comprising a patterned metal layer having pads at interconnect sites, wherein a width of a said pad at a said interconnect site is less than a nominal width of a contact interface between a said bump and the die pad.
Dependencies are inferred from the claim text.