Exposure apparatus
AssigneeCanon Kabushiki Kaisha
InventorsTakeo Kihara, Issei Funayoshi
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Abstract
Disclosed is an exposure apparatus and a device manufacturing method, in which an amount of wafer warp produced as a result of device manufacturing processes made earlier is measured or inputted in relation to each wafer lot or each wafer in the lot as a process parameter, while on the other hand correction quantities related to various parameters such as driving speeds of conveyance system robots such as a wafer stage, a wafer conveying hand of a wafer conveyance system, and a prealignment stage and so on, as well as a reduced pressure level and a reduced pressure level threshold or the like, corresponding to the wafer warp, are calculated and stored as a database, such that these parameters can be switched or newly set in accordance with the thus prepared database.
Claims15
In a device manufacturing apparatus, the improvements residing in:
- means for changing a condition in a process related to device manufacture, on the basis of a warp of a substrate used to constitute a device.
A device manufacturing method, comprising the steps of:
- preparing a substrate to be used to constitute a device;
- and
- changing a condition in a process related to device manufacture, on the basis of a warp of the substrate.
Dependencies are inferred from the claim text.