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US 2006/0215383 A1Published application
Attaching heat sinks to printed circuit boards using preloaded spring assemblies
AssigneeIntel Corporation
InventorEd Unrein
Life of this patent
Estimating the term…
Abstract
An integrated circuit assembly including a heat sink, a socket, a printed circuit board and a chassis to be held together under spring bias. The assembly may be secured together with less than 2 mm spanning between a printed circuit board and a chassis.
Claims30
A method comprising:
- spring biasing a lift plate towards a heat sink to compress an intervening socket against an integrated circuit.
A heat sink assembly comprising:
- a printed circuit board;
- a heat sink;
- a lift plate;
- and
- a plurality of preloaded spring assemblies to spring bias said lift plate and said heat sink together, said spring assemblies including screws extending through said heat sink.
2 more elements
A system comprising:
- a processor;
- a printed circuit board, said processor mounted on said printed circuit board;
- a heat sink mounted on said processor;
- and
- a plurality of preloaded spring assemblies to spring bias said lift plate and said heat sink together, said spring assemblies including screws extending through said heat sink.
2 more elements
Dependencies are inferred from the claim text.