Dissipating apparatus for integrated circuit chip and display module including the same

A display module for use with a flat display panel device, the module comprising:

• a flat panel configured to produce an image;
• a chassis configured to support the panel;
• at least one circuit board installed at a rear of the chassis, and including at least one IC chip that is configured to generate heat;
• and
• a heat dissipating apparatus including i) a chip contact plate contacting the at least one IC chip and ii) a heat discharging plate, wherein the heat discharging plate includes a plurality of pairs of heat dissipating portions formed on the chip contact plate, wherein each pair of heat dissipating portions includes a top which does not contact the chip contact plate and two spaced bottoms which contact the chip contact plate, so that each pair of heat dissipating portions defines, in conjunction with a portion of the chip contact plate, a partially covered air passage, and wherein the heat discharging plate is configured to dissipate the generated heat at least via the partially covered air passage.