Apparatus, system, and method for removing excess heat from a component
OwnerVinod Kamath, Albert Makley +1inventors
InventorsVinod Kamath, Albert Makley, Jason Matteson
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Abstract
An apparatus, system, and method are disclosed for removing excess heat from a component. A heat sink is included and located in an area in a computer with excess cooling capacity. A heat pipe is included and is connected to the heat sink and extends to a heat sensitive component located in the computer. A heat conducting compliance pad is connected to the heat sensitive component. A heat conducting metallic connector is connected to the heat pipe and to the compliance pad.
Claims30
An apparatus to remove excess heat from a component, the apparatus:
- comprising:
- a heat sink located in an area in a computer with excess cooling capacity;
- a heat pipe connected to the heat sink and extending to a heat sensitive component located in the computer;
- a heat conducting compliance pad connected to the heat sensitive component;
- and
- a heat conducting metallic connector connected to the heat pipe and to the compliance pad.
A system to remove excess heat from a component, the system comprising:
- a computer connected to a computer network wherein the computer comprises
- a heat sink located in an area in the computer with excess cooling capacity;
- a heat pipe connected to the heat sink and extending to a heat sensitive component located in the computer;
- and
- a heat conducting compliance pad connected to the heat pipe.
An apparatus to remove excess heat from a component, the apparatus comprising:
- a heat sink comprising a flat aluminum plate extending from a heat sensitive component located in the computer to an area in the computer with excess cooling capacity;
- a heat pipe connected along the length of the heat sink;
- and
- a heat conducting compliance pad connected to the heat sensitive component and to the heat sink.
A method for removing excess heat from a component, the method comprising:
- locating a heat sink in an area in a computer with excess cooling capacity;
- connecting a heat pipe to the heat sink and extending the heat sink to a heat sensitive component in the computer;
- connecting a heat conducting compliance pad to the heat sensitive component;
- and
- connecting a heat conducting metallic connector to the heat pipe and to the compliance pad.
An apparatus to remove excess heat from a component, the apparatus comprising:
- means for locating a heat sink in an area in a computer with excess cooling capacity;
- means for connecting a heat pipe to the heat sink and extending the heat sink to a heat sensitive component in the computer;
- means for connecting a heat conducting compliance pad to the heat sensitive component;
- and
- means for connecting a heat conducting metallic connector to the heat pipe and to the compliance pad.
A method for deploying computing infrastructure, wherein the computing system comprises an apparatus for removing excess heat from a component comprising:
- a heat sink located in an area in a computer with excess cooling capacity;
- a heat pipe connected to the heat sink and extending to a heat sensitive component located in the computer;
- a heat conducting compliance pad connected to the heat sensitive component;
- and
- a heat conducting metallic connector connected to the heat pipe and to the compliance pad.
Dependencies are inferred from the claim text.