Heatsink for high-power microprocessors
OwnerCuong Leinventor
Life of this patent
Estimating the term…
Abstract
A heatsink for removing heat from a heat source such as an integrated circuit, a power supply, or a microprocessor. The heatsink includes a base having an airflow passage. The base is also adapted to contact at least a portion of the heat source. The heatsink further includes a pad placed in thermal contact with the base. The pad is configured with an array of individual conduits positioned over the airflow passage of the heatsink base. The array of individual conduits permit air to flow from the airflow passage, through the array of conduits.
Claims19
A heatsink for removing heat from a heat source, said heatsink comprising:
- a base comprising an airflow passage and adapted to contact at least a portion of said heat source;
- and
- a pad in thermal contact with said base, said pad comprising an array of conduits positioned over said airflow passage and permitting air to flow from said airflow passage, through said array of conduits.
A circuit board assembly, comprising:
- a circuit board;
- an electronic component coupled to said circuit board;
- a heatsink for removing heat from said electronic component, said heatsink comprising:
- a base comprising an airflow passage and adapted to contact at least a portion of said electronic component;
- and <a pad in thermal contact with said base, said pad comprising an array of conduits positioned over said airflow passage and permitting air to flow from said airflow passage, through said array of conduits.
A heatsink for removing heat from a heat source, said heatsink comprising:
- receiving means for receiving air from atmosphere externally located relative to said heatsink;
- and
- directing means for convectively directing said air from said receiving means through an array of conduits.
An apparatus for removing heat from a heat source, said apparatus comprising:
- a base comprising airflow passages and adapted to contact at least a portion of said heat source;
- upper and lower plates, wherein said lower plate thermally contacts said base;
- apertures formed in said upper and lower plates;
- and
- an array of conduits positioned between said upper and lower plates, wherein each conduit of said array of conduits is associated with at least one of said apertures formed in each of said upper and lower plates.
Dependencies are inferred from the claim text.