ESD foam ground clip

A method for inserting an electronic device into ESD foam, the method comprising:

• inserting a low-impedance contact into the ESD foam;
• connecting the low-impedance contact to ground;
• and
• inserting the pins of an electronic device into the ESD foam.

A method for removing an electronic device from ESD foam, the method comprising:

• inserting a low-impedance contact into ESD foam;
• connecting the low-impedance contact to ground;
• and
• removing the electronic device pins from the ESD foam.

An apparatus comprising:

• a printed wiring board having a first side and a second side, wherein one or more electronic devices are mounted on one or more of the first side and the second side;
• one or more low-impedance contacts mounted on one or more of the first side and the second side;
• a ground bus adapted to electrically couple the one or more low-impedance contacts together;
• and
• ESD foam mounted onto the one or more low-impedance contacts between a source of secondary electron emissions and the one or more electronic devices.

A method for shielding electronic devices from secondary electron emissions in a flash x-tray test system, the method comprising:

• inserting a layer of ESD foam between a source of secondary electron emissions and the electronic devices;
• inserting one or more low-impedance contacts into the ESD foam;
• connecting the one or more low-impedance contacts to ground;
• capturing electrons in the ESD foam;
• and
• draining electrons captured by the ESD foam to ground.

A low impedance contact, the contact comprising:

• a plurality of metal pins;
• a holding plate adapted to hold the plurality of metal pins approximately parallel to each other;
• and
• a ground bus, the ground bus adapted to electrically couple each of the plurality of metal pins to each other.