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US 2006/0214301 A1Published application
Connection device
AssigneeInternational Business Machines Corporation
InventorsDavid Frank, Kathryn Guarini, Christopher Murray, Xinlin Wang, Hon-Sum Wong
Life of this patent
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Abstract
A connection device includes a plurality of re-configurable vias that connect a first metal layer to a second metal layer. An actuating element is disposed between the first metal layer and the second metal layer. The actuating element changes the configuration of the plurality of re-configurable vias to change the plurality of re-configurable vias between a conductive state and a non-conductive state.
Claims14
A connection device that connects layers of integrated circuits, comprising:
- a first metal layer;
- a second metal layer;
- a plurality of re-configurable vias that connect the first metal layer to the second metal layer;
- and
- an actuating element disposed between the first metal layer and the second metal layer, the actuating element changing a configuration of the plurality of re-configurable vias so that the plurality of re-configurable vias change between a conductive state and a non-conductive state.
2 more elements
Dependencies are inferred from the claim text.