Leadframe for semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsKazumitsu Seki, Harunobu Sato, Muneaki Kure
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Abstract
A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to the inner lead section. The leadframe has (1) a nickel (Ni) layer 1, (2) a palladium (Pd) or palladium alloy layer 2, (3) a tin (Sn) or tin alloy layer or a zinc (Zn) or zinc alloy layer 3, 3a, or 3b, and (4) a gold (Au) layer 4, 4a, or 4b, all of which are formed on a base material B forming the leadframe in sequence from the surface of the leadframe.
Claims8
A leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to the inner lead section, said leadframe having a plurality of layers, comprising:
- a nickel (Ni) layer;
- a palladium (Pd) or palladium alloy layer;
- an amphoteric metal layer;
- and
- a gold (Au) layer, all of which are formed on a base material forming the leadframe, in sequence from the surface thereof.
Dependencies are inferred from the claim text.