Low-dishing composition and method for chemical-mechanical planarization with branched-alkylphenol-substituted benzotriazole
OwnerJunaid Siddiqui, Timothy Comptoninventors
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OwnerJunaid Siddiqui, Timothy Comptoninventors
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A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises a branched-alkylphenol-substituted-benzotriazole. The composition affords low dishing, high metal removal rates, and high selectivities for removal of copper in relation to barrier layer materials and dielectric materials whilst minimizing local erosion effects in CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP). The composition may also further comprise an isothiazoline compound to synergistically impart lower dishing levels during CMP processing.
A polishing composition comprising:
A polishing composition comprising:
A polishing composition comprising:
A polishing method comprising the steps of:
Dependencies are inferred from the claim text.