Sputtering device

Abstract

An object of the invention is to provide a sputtering device which can increase forming film distribution and coverage distribution without enlarging a size thereof. Accordingly, the present invention is a sputtering device comprising at least: a vacuum chamber; a sputtering cathode secured in said vacuum chamber; and a substrate holder unit installing a substrate on which thin film is formed with particles sputtered from said sputtering cathode, wherein said substrate holder unit comprises: a substrate supporting portion on which the substrate is installed; a heater mechanism which is provided in said substrate support portion and heats the substrate; a cooling mechanism for cooling said heater mechanism; a bias applying mechanism for applying bias voltage to said substrate supporting portion; an arcuate moving base to which said heater mechanism, said cooling mechanism and said bias applying mechanism are secured and which supports said substrate supporting portion rotatably; an eccentric shaft which extends from said arcuate moving base eccentrically relative to a rotation center of said substrate supporting portion and is supported in said vacuum chamber rotatably; a rotation mechanism which is provided through said eccentric shaft and makes said substrate supporting portion rotate; and an arcuate moving mechanism for rotating said eccentric shaft.

Dependencies are inferred from the claim text.