Method for preparing a polishing slurry having high dispersion stability

Abstract

The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the resulting dispersion an alkaline material in an amount of 0.1 to 8 weight parts based on 100 weight parts of the polishing particles. The polishing slurry obtained by the inventive method exhibits good dispersion stability and non-Prestonian polishing performance, which can be beneficially employed in chemical mechanical polishing of various precision electronic devices.

Dependencies are inferred from the claim text.