Low profile LGA socket assembly
AssigneeAdvanced Interconnections Corporation
InventorsGlenn Goodman, Michael Murphy, Gary Eastman, Curtis Wilmot, Ronald Lambert
Life of this patent
Estimating the term…
Abstract
A socket terminal assembly is configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end defining a first open cavity; a pin including an end defining a second open cavity; and a coiled spring interposed between the socket shell and the pin, the spring including a first end section received within the first open cavity and a second end section received within the second open cavity.
Claims22
A socket terminal assembly configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising:
- a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end defining a first open cavity;
- a pin including an end having a second open cavity;
- and
- a coiled spring interposed between the socket shell and the pin, the spring including a first end section received within the first open cavity and a second end section received within the second open cavity.
An intercoupling component configured to electrically connect contacting areas of an integrated circuit with corresponding connection regions of a substrate, the intercoupling component comprising:
- a plurality of socket shells each having a first end configured to contact the corresponding connection region of the substrate;
- a socket support member defining a plurality of member openings extending from a lower surface to an opposing upper surface, each opening receiving a socket shell;
- and
- a plurality of coiled springs each having a first end section having an unconstrained first spring diameter and an intermediate spring section having an intermediate spring diameter, the first spring diameter being larger than the intermediate spring diameter, each spring contacting a corresponding socket shell.
A socket terminal assembly configured to electrically connect a contacting area of an integrated circuit package with a corresponding connection region of a substrate, the socket terminal assembly comprising:
- a socket body having a first end configured to contact the corresponding connection region of the substrate and a second end with a cavity defined by at least one sidewall surface;
- and
- a pin having a first end configured to be received within the cavity of the socket body and a second end adapted to contact the electrical contacting area of the integrated circuit package, the pin having a surface with a cylindrically-shaped region between the first and second ends, the cylindrically-shaped region having a resilient region in contact with the at least one sidewall surface and applying a force substantially normal to the at least one sidewall surface generating a frictional force sufficient to retain the pin within the opening of the socket body.
Dependencies are inferred from the claim text.