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US 2006/0189150 A1Published application
Composition for an organic hard mask and method for forming a pattern on a semiconductor device using the same
AssigneeHynix Semiconductor Inc.
InventorJae Jung
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Abstract
A composition for the organic hard mask includes a polyamic acid compound, and a method for forming a pattern is used in a manufacturing process of semiconductor devices by coating the composition for organic hard mask film on an underlying layer, and depositing a second hard mask film with a silicon nitride SiON film thereon to form a double hard mask film having an excellent etching selectivity, thereby obtaining a uniform pattern.
Claims17
A composition for an organic hard mask comprising:
- (i) a polyamic acid compound represented by Formula 1,
- (ii) a melamine derivative, and
- (iii) an organic solvent:
- wherein R is —NH or
1 more element
Dependencies are inferred from the claim text.