DBG system and method with adhesive layer severing
AssigneeChipPAC, Inc.
InventorsSeung Park, Hyun Park
Life of this patent
Estimating the term…
Abstract
An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) is applied to the second side. Dicing tape (24) is applied to the adhesive layer to create a first wafer assembly (32). The first wafer assembly is supported on a support surface (34) with the dicing tape facing the support surface and the back grinding tape exposed. The back grinding tape is removed and the adhesive layer is severed through the array of grooves to create individually removable die (28).
Claims6
A semiconductor wafer processing system, for processing a wafer having an array of grooves formed in a first side of the wafer and a back grinding tape adhering to the first side, comprising:
- a material removal station at which an amount of material is removable from a second side of the wafer;
- a dicing tape application station at which the wafer has an adhesive layer and a dicing tape applied to the second side, with the adhesive layer between the second side and the dicing tape, to create a first wafer assembly;
- a support surface station comprising a support surface, the support surface station further comprising
- means for removing the back grinding tape;
- and
- means for severing the adhesive layer through the array of grooves to create individually removable die;
- and
- first wafer assembly transfer apparatus arranged and adapted to transfer the first wafer assembly from the dicing tape application station to the support surface station with the dicing tape facing the support surface and the back grinding tape exposed;.
Dependencies are inferred from the claim text.