Structure containing self-aligned conductive lines and fabricating method thereof
OwnerHann-Jye Hsu, Su-Yuan Chang +1inventors
InventorsHann-Jye Hsu, Su-Yuan Chang, Min-San Huang
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OwnerHann-Jye Hsu, Su-Yuan Chang +1inventors
InventorsHann-Jye Hsu, Su-Yuan Chang, Min-San Huang
Estimating the term…
A method for fabricating self-aligned conductive lines is provided. A substrate with a plurality of isolation structures is provided. The isolation structures are protrusive from the surface of the substrate, and an active region is defined between two adjacent isolation structures. A plurality of semiconductor devices is formed in the active region. A conductive material layer is then formed on the substrate. Thereafter, a portion of the conductive material layer is removed by using the isolation structures as a removing-stop layer until the surfaces of the isolation structures are exposed and a plurality of conductive lines are formed in a self-aligned manner to electrically connect devices. As the size of the devices is scaled down, the design rule of the lithography process does not limit the size of self-aligned conductive lines. Consequently, the fabricated conductive lines are capable of effectively connecting the semiconductor devices.
A method for fabricating self-aligned conductive lines, comprising:
A structure containing self-aligned conductive lines, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.