Semiconductor chip and method of fabricating the same
AssigneeNEC Electronics Corporation
InventorsTakashi Sakoh, Ryo Kubota
Life of this patent
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Abstract
There is provided a semiconductor chip having fuses. The semiconductor chip includes fuses each having a first terminal electrically connected to a first logic circuit, a second terminal electrically connected to a second logic circuit, and a blowable region formed between the first terminal and the second terminal; and fuse residues each having the same patterns with those of the first terminal and the second terminal of the fuses, and configured so that patterns corresponded to the first terminals and the second terminals are electrically disconnected from each other.
Claims19
A method of fabricating a semiconductor chip by forming fuses with a mask having a plurality of fuse patterns formed thereon, comprising:
- specifying a fuse to be blown in common to a plurality of semiconductor chips from among a plurality of designated fuses;
- producing a mask having a plurality of fuse patterns corresponding to said designated fuses other than said fuse to be blown specified in said specifying the fuse to be blown;
- forming fuses using said mask produced in said producing the mask.
A semiconductor chip having a first logic circuit and a second logic circuit formed therein, comprising:
- a fuse having a first terminal electrically connected to said first logic circuit, a second terminal electrically connected to said second logic circuit, and a blowable region formed between said first terminal and said second terminal;
- and
- a fuse residue having the same patterns with those of said first terminal and said second terminal of said fuse, and configured so that the patterns corresponded to said first terminal and said second terminal are electrically disconnected from each other.
Dependencies are inferred from the claim text.