Method for utilizing dry film
OwnerTsung-Yen Tseng, Min-Lung Huang +2inventors
InventorsTsung-Yen Tseng, Min-Lung Huang, Chi-Iong Tsai, Min-Chih Yang
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Abstract
A method for utilizing a dry film is provided. A dry film is pressed onto a substrate, such as a wafer. The dry film includes a photoresist layer tightly attached to the substrate and an exposed carrier film with light transmission. Before exposure and development, the carrier film of the dry film is cleaned in a darkroom, wherein the cleaning method may include a step of chemical spraying and a step of rinsing through DI water. Accordingly, the contaminant on the carrier film can be removed. In addition, the dry film burrs can be also removed. Thus, an excellent production yield for sequent exposure and development can be achieved.
Claims6
A method for forming a photoresist on a wafer, comprising:
- providing a wafer with an active area;
- forming at least one photoresist layer on the active area of the wafer;
- forming a carrier film with light transmission on the photoresist layer;
- and
- cleaning the carrier film and the wafer.
Dependencies are inferred from the claim text.