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US 2006/0187642 A1Published application
Structure for heat dissipation of integrated circuit chip and display module including the same
AssigneeSamsung SDI Co., Ltd.
InventorKwang-Jin Jeong
Life of this patent
Estimating the term…
Abstract
A circuit board having a first IC chip mounted thereon, and a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portion and are inclined at an angle other than 90° from an imaginary horizontal plane.
Claims20
An integrated circuit (IC) apparatus, comprising:
- a circuit board having a first IC chip mounted thereon;
- and
- a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portion and are inclined at an angle other than 90° C. from an imaginary horizontal plane.
A display module, comprising:
- a panel configured to produce an image, a chassis disposed at a rear of the panel, and a circuit portion installed at a rear of the chassis to drive the panel, the circuit portion including:
- a circuit board having a first IC chip mounted thereon;
- and
- a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portion and are inclined at an angle other than 90° from an imaginary horizontal plane.
1 more element
Dependencies are inferred from the claim text.