Electronic component cooling and interface system
AssigneeLytron, Inc.
InventorCharles Carswell
Life of this patent
Estimating the term…
Abstract
A cooling system for a heat-generating component on a circuit board requires no fluid connections to be made or broken in order to install or remove the circuit board. In the cooling system, a heat collection device is mountable in heat transfer contact with a hot component on the circuit board. A heat removal device has a board-side device mountable to the circuit board and a complementary off-board device mountable off the circuit board. Fluid lines form a closed circulatory flow path between the heat collection device and the board-side device of the heat removal device. The board-side device and the off-board device are fastenable in heat transfer contact to transfer heat off the circuit board.
Claims37
A cooling system for a circuit board having at least one heat generating component mounted thereon, comprising:
- a heat collection device mountable to a circuit board in heat transfer contact with a heat generating component mounted on the circuit board;
- a heat removal device comprising a board-side device mountable to the circuit board and a complementary off-board device mountable off the circuit board, the board-side device and the off-board device fastenable in heat transfer contact to transfer heat off the circuit board;
- fluid lines forming a closed circulatory flow path between the heat collection device and the board-side device of the heat removal device;
- a board cooling fluid disposed for circulation within the closed circulatory flow path on the circuit board;
- and
- an off-board cooling fluid disposed for circulation through the off-board device.
A cooling system for a heat-generating component, comprising:
- a heat collection device in heat transfer contact with a heat-generating component;
- a heat removal device comprising:
- a component-side device,
- a complementary device,
- an interface comprising a non-planar surface between the component-side device and the complementary device, and
- a fastening mechanism operative to fasten the component-side device and the complementary device in heat transfer contact to transfer heat from the component-side device to the complementary device;
- fluid lines forming a closed circulatory flow path between the heat collection device and the component-side device of the heat removal device;
- a component cooling fluid disposed for circulation within the closed circulatory flow path;
- and
- a cooling fluid disposed for circulation through the complementary device.
Dependencies are inferred from the claim text.