Heat dissipating module and engaging assembly thereof

A heat dissipating module, comprising:

• a frame for accommodating a fan;
• an engaging assembly coupled to the frame and comprising:
• an engaging body comprising a hollow portion and at least one first pivot hole;
• a tongue comprising a bent portion and a bottom engaging portion, wherein the bent portion comprises at least one second pivot hole and is slidably engaged in the hollow portion;
• a resilient element fitting on the tongue and interposed between the engaging body and the bottom engaging portion of the tongue;
• a wrench bar coupled to the engaging body and comprising at least one third pivot hole;
• and
• a connecting element fitting in the first, second, and third pivot holes and disposed in the engaging body for pivoting the tongue and the wrench bar to the engaging body, wherein the caliber of the first pivot hole exceeds that of the second and third pivot holes;
• and
• a base for accommodating a microprocessor and connected to the bottom engaging portion of the tongue.

An engaging assembly for a heat dissipating module, comprising:

• an engaging body comprising a hollow portion and at least one first pivot hole;
• a tongue comprising a bent portion and a bottom engaging portion, wherein the bent portion comprises at least one second pivot hole and is slidably engaged in the hollow portion;
• a resilient element fitting on the tongue and interposed between the engaging body and the bottom engaging portion of the tongue;
• a wrench bar abutting the surface of the engaging body and comprising at least one third pivot hole;
• and
• a connecting element fitting in the first, second, and third pivot holes and disposed in the engaging body, pivoting the tongue and the wrench bar to the engaging body.