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US 2006/0186555 A1Published application
Semiconductor device with chip-on-board structure
AssigneeSamsung Electronics Co., Ltd.
InventorsChang-Il Son, Sam-Yong Bahng
Life of this patent
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Abstract
A semiconductor device may include a chip-on-board (COB) substrate having bonding patterns. A semiconductor chip having bonding pads may be electrically connected to the bonding patterns and may be arranged on the COB substrate, and the semiconductor chip may have a square shape and the bonding pads of the semiconductor chip may be arranged along at least two sides of the semiconductor chip so as to form a desired angle with respect to the bonding patterns.
Claims20
A semiconductor device, comprising:
- a chip-on-board (COB) substrate having bonding patterns;
- and
- a semiconductor chip having a square shape disposed on the COB substrate, wherein
- bonding pads are arranged along at least two adjacent sides of the semiconductor chip, and a side of the semiconductor chip is at a desired angle with respect to the bonding patterns.
1 more element
A semiconductor integrated circuit (IC) card, comprising:
- a chip-on-board (COB) board substrate having bonding patterns;
- external connection pins disposed along a peripheral edge of a side on the COB substrate;
- a first semiconductor chip disposed on the COB substrate;
- and
- a second semiconductor chip arranged on the first semiconductor chip and having bonding pads electrically connected to the bonding patterns,
- wherein the second semiconductor chip has a square shape and the bonding pads of the second semiconductor chip are arranged along at least two adjacent sides of the second semiconductor chip at a desired angle with respect to the external connection pins.
3 more elements
A semiconductor device, comprising:
- a chip-on-board (COB) substrate having bonding patterns;
- and
- a semiconductor chip having a square shape disposed on the COB substrate, wherein the semiconductor chip is arranged to have at least one of its edges at no more than 90 degrees with respect to the bonding patterns.
Dependencies are inferred from the claim text.