Semiconductor packages and methods for making and using same

An array of semiconductor packages, comprising:

• a substrate having a first surface and a second surface;
• a plurality of first grooves formed in the first surface, the plurality of first grooves forming a plurality of segments in the substrate;
• a plurality of semiconductor die mounted to the second surface of the substrate, each semiconductor die being mounted to a corresponding segment;
• and
• an encapsulant formed onto each of the plurality of semiconductor die, the encapsulant having a plurality of second grooves substantially aligned with the plurality of first grooves.

A method of forming an array of semiconductor packages, comprising:

• forming a substrate having first and second surfaces;
• forming a plurality of segments in the substrate by forming a plurality of first grooves in the first surface;
• mounting a semiconductor die on to the second surface of each segment of the substrate;
• and
• forming an encapsulant onto each of the plurality of segments, the encapsulant having a plurality of second grooves substantially aligned with the plurality of first grooves.