Germanium-silicon-carbide floating gates in memories
AssigneeMicron Technology, Inc.
InventorsLeonard Forbes, Kie Ahn
Life of this patent
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Abstract
The use of a germanium carbide (GeC), or a germanium silicon carbide (GeSiC) layer as a floating gate material to replace heavily doped polysilicon (poly) in fabricating floating gates in EEPROM and flash memory results in increased tunneling currents and faster erase operations. Forming the floating gate includes depositing germanium-silicon-carbide in various combinations to obtain the desired tunneling current values at the operating voltage of the memory device.
Claims50
A field effect transistor, comprising:
- a substrate having a first doping type and first doping level;
- at least one source diffusion region having a second doping type and a second doping level, and at least one drain diffusion region having the second doping type and the second doping level separated from the at least one source diffusion region by a channel region having the first doping type and a third doping level;
- a gate insulator having a first thickness disposed on the substrate and extending over the entire channel region and at least a portion of the source diffusion region and at least a portion of the drain diffusion region;
- and
- a floating gate electrode disposed over the gate insulator and extending over at least a portion of each of the source and drain diffusion regions, formed of a mixture including at least germanium and carbon, having a first percentage of germanium atoms, a second percentage of silicon atoms, and a third percentage of carbon atoms;
- an inter-gate insulator disposed over the floating gate;
- and
- a control gate disposed over the inter-gate insulator.
An integrated circuit memory cell, comprising:
- a transistor having a source, a drain, a channel region, a floating gate, and a control gate;
- and
- the floating gate is formed of a mixture of germanium, silicon and carbon to form a film having at least enough electrical conductivity to redistribute trapped electrons essentially evenly throughout the film.
A memory device, comprising:
- an array of memory cells, each of the memory cells comprising:
- a source region;
- a drain region;
- a semiconductive channel region separating the source and drain regions;
- a floating gate having a germanium, silicon and carbide composition, disposed adjacent the semiconductive channel region and separated therefrom by a first insulating layer;
- and
- a control gate located adjacent the floating gate and separated therefrom by a second insulating layer, the control gate coupled to a word line;
- addressing circuitry for addressing the array of memory cells;
- and
- control circuitry for controlling read and write operations of the memory device.
A method of storing data in a memory device, comprising:
- addressing selected ones of a plurality of memory cells with selected ones of a plurality of word lines and a plurality of bit lines;
- increasing a voltage applied to a control gate on the selected memory cells, the memory cells each including a substrate, a source region, a drain region and a floating gate disposed beneath the control gate and separated therefrom by an inter-gate insulator layer, the floating gate comprising a conductive film including a mixture of germanium, silicon and carbon;
- trapping electrons on the floating gate in response to a positive voltage having at least a first voltage level being applied to the control gate for at least a first time period, changing the memory cell to a first memory state;
- and
- ejecting electrons from the floating gate in response to a negative voltage having at least a second voltage level being applied to the control gate for at least a second time period, changing the memory cell to a second memory state.
A method of forming a memory cell, comprising:
- forming a source region, a drain region, and a channel region disposed between and separating the source and drain regions, in a semiconductor substrate;
- forming a gate oxide layer on the semiconductor substrate over at least the channel region and over at least portions of the source and drain regions;
- forming an electrically isolated floating gate over the channel region and over at least portions of each of the source and drain regions, the floating gate formed of a mixture consisting essentially of silicon, germanium and carbon;
- forming an inter-gate insulator over the floating gate;
- and
- forming a control gate over the inter-gate insulator and separated from the floating gate by the inter-gate insulator.
A method comprising:
- providing a controller;
- and
- coupling an integrated circuit to the controller, wherein the integrated circuit includes at least one transistor having a floating gate and a control gate, wherein the floating gate includes carbon and at least one of germanium and silicon, and has a lower electron tunneling barrier for the floating gate than a doped polycrystalline silicon floating gate.
An electronic device comprising:
- a floating gate containing carbon and at least one of germanium and silicon in an integrated circuit;
- and
- a control gate disposed above the floating gate.
A transistor, comprising:
- a substrate having at least a source region and a drain region;
- a gate insulator disposed over the substrate and at least portions of the source and drain regions;
- and
- a gate electrode disposed over the gate insulator and at least portions of the source and drain regions formed of germanium silicon carbide, wherein the composition of the germanium silicon carbide is selected to obtain a desired threshold voltage for the transistor.
Dependencies are inferred from the claim text.