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US 2006/0186405 A1Published application
Semiconductor device and manufacturing process therefor
AssigneeNEC Electronics Corporation
InventorAkihito Tanabe
Life of this patent
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Abstract
An objective of this invention is to allow each process of contacting of a test probe and bonding to be reliably conducted within a given region. A semiconductor device 100 has a probing mark 111 forming region; a bonding pad 110 having a bonding region 113; and a check mark 120 separate from the bonding pad 110. In the configuration, the probing mark 111 forming region and the bonding region 113 can be identified on the basis of a planar shape of the check mark 120.
Claims12
A semiconductor device, comprising:
- a bonding pad comprising a bonding region and a test-probe-contacting region within one pad;
- and
- an area identification mark separate from said bonding pad such that it indicates a border between said bonding region and said test-probe-contacting region.
Dependencies are inferred from the claim text.