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OwnerLee Levine, Matthew Osborne +2inventors
InventorsLee Levine, Matthew Osborne, Stephen Babinetz, Jon Brunner
Estimating the term…
A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding the pre-deformed ball to the bonding pad. The wire bonder includes a source of heat disposed adjacent a bonding tool to melt a portion of the bonding wire to produce the bonding ball at an end thereof, and a pre-deforming unit including a deforming surface to pre-deform at least a portion of the bonding ball.
A method of bonding a bonding wire to a bonding pad of a bonding location for use with a wire bonder, the method comprising the steps of:
A method of wire bonding a bonding wire to a wire bonding surface, comprising the steps of:
A wire bonder for bonding a bonding wire to a bonding pad of a bonding location using a wire bonding tool, the wire bonder comprising:
Dependencies are inferred from the claim text.