Wire bonding method

A wire bonding method for bonding a first bond point which is an interconnect wiring and a second bond point which is a pad, said bonding method comprising the steps of:

• forming a bump beforehand on the second bond point by way of bonding a first ball formed at a tip end of a wire to the second bond point by causing a capillary to descend,
• bonding a second ball formed at a tip end of a tail of the wire to the first bond point by causing the capillary to descend to form a first bonding part on the first bond point, and then
• bonding the wire to the bump on the second bond point to form a second bonding part,
• thus connecting the first bond point and the second bond point with the wire,
• wherein said wire bonding method
• examines if the bump is bonded to the pad before the wire is cut to form the bump and the capillary is ascended, and upon detecting that the bump is not bonded to the pad, a capillary is again caused to descend to execute boding of the non-bonded bump to the second bond point;
• and further,
• examines, after the ball is bonded to the first bond point and the capillary is ascended, if the first bonding part is bonded to the first bond point, and upon finding that the first bonding part is not bonded to the first bond point, then the capillary is caused to descend to execute bonding of the non-bonded first bonding part to the first bond point.