Anodized substrate support

A method of supporting a glass substrate, comprising:

• providing a substrate support having:
• an electrically conductive body;
• a substrate contact area formed on the surface of the substrate support, wherein the process of forming the substrate contact area comprises:
• forming an electrically insulative coating on a surface region of the electrically conductive body, the coating having a thickness of between about 0.3 mils and about 2.16 mils, wherein the surface region substantially corresponds to the substrate contact area;
• and
• preparing the surface region to a surface roughness between about 88 micro-inches and about 230 micro-inches;
• positioning the substrate support adjacent a substrate processing region in a substrate processing chamber, wherein the substrate contact area is adjacent the substrate processing region;
• positioning a substrate on the substrate contact area;

A method of processing a glass substrate, comprising:

• forming a substrate contact area on a substrate support having an aluminum body, the process of forming the substrate contact area comprising:
• preparing a surface region of the substrate support to a surface roughness between about 88 micro-inches and about 230 micro-inches, wherein the surface region substantially corresponds to the substrate contact area;
• and
• anodizing at least the surface region of the substrate support to a thickness of between about 0.3 mils and about 2.16 mils after the process of preparing the surface region;
• positioning the substrate support adjacent a substrate processing region in a substrate processing chamber, wherein the substrate contact area is adjacent the substrate processing region;
• positioning a glass substrate on the substrate contact area;
• introducing a silicon-containing gas into the substrate processing region;
• producing a plasma in the substrate processing region to excite the silicon-containing gas;
• and
• depositing a silicon-containing film on the substrate.