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US 2006/0185688 A1Published application
Semiconductor wafer cleaning method and wafer cleaned by same method
AssigneeHitachi Cable, Ltd.
InventorsSatoshi Uematsu, Hisashi Mashiyama, Takehiko Tani
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Abstract
A semiconductor wafer cleaning method has steps of cleaning a surface of a semiconductor wafer with a cleaning solution that has an etching function; and cleaning the surface of the semiconductor wafer with a high-purity organic solvent while circulating the high-purity organic solvent so as to remove Ca and Mg on the surface of the semiconductor wafer.
Claims12
A semiconductor wafer cleaning method, comprising:
- cleaning a surface of a semiconductor wafer with a cleaning solution that has an etching function;
- and
- cleaning the surface of the semiconductor wafer with a high-purity organic solvent while circulating the high-purity organic solvent so as to remove Ca and Mg on the surface of the semiconductor wafer.
Dependencies are inferred from the claim text.