Back to results
US 2006/0185588 A1Published application
Vapor deposition apparatus measuring film thickness by irradiating light
AssigneeTokyo Electron Limited
InventorsToshihisa Nozawa, Masaji Inoue
Life of this patent
Estimating the term…
Abstract
A substrate to be processes is accommodated in a process container. A vapor deposition source retains a vapor deposition material to be deposited on the substrate to be processed. A measuring device measures a film thickness of a vapor deposition film produced in said process container. The measuring device measures the film thickness by irradiating a light onto the vapor deposition film.
Claims10
A vapor deposition apparatus comprising:
- a process container in which a substrate to be processed is accommodated;
- a vapor deposition source that retains a vapor deposition material to be deposited on the substrate to be processed;
- and
- a measuring device that measures a film thickness of a vapor deposition film produced in said process container,
- wherein said measuring device measures the film thickness by irradiating a light onto said vapor deposition film.
2 more elements
Dependencies are inferred from the claim text.