Liquid-cooling heat dissipation assembly
AssigneeCooler Master Co., Ltd.
InventorsQiang-Fei Duan, Tai-Yang Jiang
Life of this patent
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Abstract
A liquid-cooling heat dissipation assembly includes a liquid cooling array module with an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively, a liquid driving module assembled to the upper cover of the liquid cooling array module, a cooling plate module assembled with the lower cover of the liquid cooling array module, a liquid passageway defined through the liquid cooling array module and the cooling plate module. The liquid cooling array module, the liquid driving module and the cooling plate module are integrated into assembly and a through runner keeps the cooling liquid to flow continuously. The heat exchange cycle can be speeded up and the heat dissipation efficiency can be enhanced.
Claims6
A liquid-cooling heat dissipation assembly used to dissipate heat from an electronic device by circulating a cooling liquid, comprising
- a liquid cooling array module comprising a plurality of heat-dissipating fins, an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively;
- a liquid driving module driving the cooling liquid and assembled to the upper cover of the liquid cooling array module;
- a cooling plate module with a heat absorbing face on bottom thereof and in contact with the electronic device, the cooling plate module having a top side assembled with the lower cover of the liquid cooling array module;
- and
- a liquid passageway defined through the liquid cooling array module, the liquid driving module and the cooling plate module, the cooling liquid flowing along the liquid passageway to circulate through the liquid cooling array module, the liquid driving module and the cooling plate module when the liquid driving module operates.
Dependencies are inferred from the claim text.