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US 2006/0179632 A1Published application
Support system for semiconductor wafers
AssigneeIntel Corporation
InventorsBrian Wilk, Frank Joyce, Douglas Kreager, Thomas Repko
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.
Claims13
A wafer support system comprising:
- a body having a perforated surface to support a semiconductor wafer and one or more cavities able to trap gas pressure when sealed, wherein said one or more cavities have orifices on an opposite side of said body;
- and
- a membrane to be attached to said opposite side to seal said orifices.
Dependencies are inferred from the claim text.